Apparatus and method of measuring a property of a substrate
US8786825B2 · kind B2 · utility
24Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2009 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Aug 24, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7088
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention makes the use of measurement of a diffraction spectrum in or near an image plane in order to determine a property of an exposed substrate. In particular, the positive and negative first diffraction orders are separated or diverged, detected and their intensity measured to determine overlay (or other properties) of exposed layers on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.