Chip packaging fixture using magnetic field for self-alignment
US8789267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2010 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | May 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.