Sealed elastomer bonded Si electrodes and the like for reduced particle contamination in dielectric etch
US8789493B2 · kind B2 · utility
6Cited by
18References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2006 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Mar 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.