Patent · US Active

Adjusting sizes of connectors of package components

US8791579B2 · kind B2 · utility

5Cited by

5References

17Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chih-Wei Lai · Baoshan, TW
Ming-Che Ho · Tainan, TW
Tzong-Hann Yang · Taipei, TW
Chien Rhone Wang · Baoshan, TW
Chia-Tung Chang · Baoshan, TW
Hung-Jui Kuo · Hsinchu, TW
Chung-Shi Liu · Baoshan, TW

Key dates

Filing date	Nov 17, 2011
Grant date	Jul 29, 2014
Priority date	—
Expiry date	Jul 13, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.