Patent · US Active

Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)

US8794011B2 · kind B2 · utility

1Cited by

19References

29Claims

0Family size

Assignee

NIKON CORPORATION · JP

Inventors

Alton H. Phillips · East Palo Alto, US
Akio Ohta · Kudamatsu, JP
Douglas C. Watson · Campbell, US

Key dates

Filing date	Oct 11, 2011
Grant date	Aug 5, 2014
Priority date	—
Expiry date	Nov 21, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01J2005/0077
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.