Substrate processing method and substrate processing system for performing the same
US8795541B2 · kind B2 · utility
2Cited by
0References
11Claims
0Family size
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Key dates
| Filing date | Dec 8, 2011 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a supercritical fluid method a supercritical fluid is supplied into a process chamber. The supercritical fluid is discharged from the process chamber as a supercritical fluid process proceeds. A concentration of a target material included in the supercritical fluid discharged from the process chamber is detected during the supercritical fluid process. An end point of the supercritical fluid process may be determined based on a detected concentration of the target material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.