Stacked semiconductor chip device with thermal management circuit board
US8796842B2 · kind B2 · utility
2Cited by
6References
25Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 20, 2010 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.