Electrostatic chuck and a method for supporting a wafer
US8804299B2 · kind B2 · utility
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21Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 13, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck includes an isolating substrate that surrounds at least one electrode; multiple protrusions having upper portions arranged to contact a wafer; and at least one discharging element positioned between the at least one electrode and the upper portions of the multiple protrusions; which discharging element, once coupled to a discharging circuit, is arranged to discharge charge accumulated in the isolating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.