Integrated circuit package connected to a data transmission medium

US8805132B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Harry Barowski · Balingen, DE
• Thomas J. Brunschwiler · Thalwil, CH
• Roger F. Dangel · Zug, CH
• Hubert Harrer · Böblingen, DE
• Andreas Huber · Holzgerlingen, DE
• Norbert M. Meier · Thalwil, CH
• Bruno Michel · Thalwil, CH
• Tim Niggemeier · Laatzen, DE
• Stephan Paredes · Thalwil, CH
• Jochen Supper · Herrenberg, DE
• Jonas R. Weiss · Thalwil, CH

Key dates

• Filing date: Dec 6, 2011
• Grant date: Aug 12, 2014
• Expiry date: Jan 29, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1533
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.