Current peak spreading schemes for multiplexed heated array
US8809747B2 · kind B2 · utility
15Cited by
90References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Sep 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B1/0233
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.