Semiconductor device including in wafer inductors, related method and design structure
US8809998B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2011 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Dec 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/101
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An Integrated Circuit (IC) and a method of making the same. In one embodiment, the IC includes: a substrate; a first set of trenches formed in a first surface of the substrate; a second set of trenches formed in a second surface of the substrate; and at least one through silicon via connecting the first set of trenches and the second set of trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.