Low temperature bonding material comprising coated metal nanoparticles, and bonding method
US8821676B2 · kind B2 · utility
2Cited by
5References
7Claims
0Family size
Assignee
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Key dates
| Filing date | May 3, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/8305
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.