Package on package devices and methods of packaging semiconductor dies
US8823180B2 · kind B2 · utility
20Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2012 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Aug 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a bottom packaged die having solder balls disposed on the top surface thereof and a top packaged die having metal stud bumps disposed on a bottom surface thereof. The metal stud bumps include a bump region and a tail region coupled to the bump region. Each metal stud bump on the top packaged die is coupled to one of the solder balls on the bottom packaged die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.