Supply voltage or ground connections for integrated circuit device
US8829693B2 · kind B2 · utility
0Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2013 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Sep 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.