Stackable layer containing ball grid array package
US8835218B2 · kind B2 · utility
0Cited by
37References
25Claims
0Family size
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Key dates
| Filing date | Jul 12, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | May 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.