Patent · US Active

Method of making a high frequency device package

US8839508B2 · kind B2 · utility

2Cited by

56References

7Claims

0Family size

Assignee

Rosenberger Hochfrequenztechnik GmbH & Co. KG · DE

Inventors

Eric A. Sanjuan · San Jose, US
Sean S. Cahill · Palo Alto, US

Key dates

Filing date	Nov 30, 2011
Grant date	Sep 23, 2014
Priority date	—
Expiry date	Nov 30, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A fabrication method for a low-cost high-frequency electronic device package having waveguide structures formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.