Chamber with uniform flow and plasma distribution
US8840725B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Sep 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32844
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide a recursive liner system that facilitates providing more uniform flow of gases proximate the surface of a substrate disposed within an apparatus for processing a substrate (e.g., a process chamber). In some embodiments, a recursive liner system may include an outer liner having an outer portion configured to line the walls of a process chamber, a bottom portion extending inward from the outer portion, and a lip extending up from the bottom portion to define a well; and an inner liner having a lower portion configured to be at least partially disposed in the well to define, together with the outer liner, a recursive flow path therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.