Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
US8840811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2010 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Mar 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.