Semiconductor device package and method of manufacture
US8841758B2 · kind B2 · utility
5Cited by
41References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Jul 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method to improve saw singulation quality and wettability of integrated circuit packages (140) assembled with lead frames (112) having half-etched recesses (134) in leads. A method of forming a semiconductor device package includes providing a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.