Methods for depositing thin films comprising gallium nitride by atomic layer deposition
US8846502B2 · kind B2 · utility
449Cited by
5References
35Claims
0Family size
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Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Aug 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0262
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Atomic layer deposition (ALD) processes for forming thin films comprising GaN are provided. In some embodiments, ALD processes for forming doped GaN thin films are provided. The thin films may find use, for example, in light-emitting diodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.