Thermally conductive coil and methods and systems
US8847721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Sep 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/074
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide improved thermal conductivity within, among other things, electromagnetic coils, coil assemblies, electric motors, and lithography devices. In one embodiment, a thermally conductive coil includes at least two adjacent coil layers. The coil layers include windings of wires formed from a conductor and an insulator that electrically insulates the windings within each coil layer. In some cases the insulator of the wires is at least partially absent along an outer surface of one or both coil layers to increase the thermal conductivity between the coil layers. In some embodiments, an insulation layer is provided between the coil layers to electrically insulate the coil layers. In some cases the insulation layer has a thermal conductivity greater than the thermal conductivity of the wire insulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.