Methods for automatically characterizing a plasma
US8849585B2 · kind B2 · utility
1Cited by
23References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 2, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | May 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/327
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for automatically characterizing plasma during substrate processing is provided. The method includes collecting a set of process data, which includes at least data about current and voltage. The method also includes identifying a relevancy range for the set of process data, wherein the relevancy range includes a subset of the set of process data. The method further includes determining a set of seed values. The method yet also includes employing the relevancy range and the set of seed values to perform curve-fitting, wherein the curve-fitting enables the plasma to be automatically characterized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.