Method for designing optical lithography masks for directed self-assembly
US8856693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2012 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and a computer system for designing an optical photomask for forming a prepattern opening in a photoresist layer on a substrate wherein the photoresist layer and the prepattern opening are coated with a self-assembly material that undergoes directed self-assembly to form a directed self-assembly pattern. The methods includes: generating a mask design shape from a target design shape; generating a sub-resolution assist feature design shape based on the mask design shape; using a computer to generate a prepattern shape based on the sub-resolution assist feature design shape; and using a computer to evaluate if a directed self-assembly pattern of the self-assembly material based on the prepattern shape is within specified ranges of dimensional and positional targets of the target design shape on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.