Patent · US Active

Method, apparatus for holding and treatment of a substrate

US8857805B2 · kind B2 · utility

2Cited by

8References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerald Lackner · Arnoldstein, AT
Christian Maier · Kettenham, DE
Francisco Javier Santos Rodriguez · Villach, AT

Key dates

Filing date	Sep 7, 2007
Grant date	Oct 14, 2014
Priority date	—
Expiry date	Nov 28, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/6834
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.