Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
US8860496B2 · kind B2 · utility
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1References
15Claims
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Key dates
| Filing date | Sep 9, 2013 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Sep 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.