Metrology systems and methods for high aspect ratio and large lateral dimension structures
US8860937B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2013 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Jan 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various metrology systems and methods for high aspect ratio and large lateral dimension structures are provided. One method includes directing light to one or more structures formed on a wafer. The light includes ultraviolet light, visible light, and infrared light. The one or more structures include at least one high aspect ratio structure or at least one large lateral dimension structure. The method also includes generating output responsive to light from the one or more structures due to the light directed to the one or more structures. In addition, the method includes determining one or more characteristics of the one or more structures using the output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.