Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
US8865525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2012 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Feb 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a careless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump to form a cavity and expose the electrical pad from a closed end of the cavity; wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical pad. The careless buildup circuitry provide signal routing for the semiconductor device while the built-in stiffener can provide adequate mechanical support for the careless build-up circuitry and the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.