Patent · US Active

Power module with directly attached thermally conductive structures

US8872332B2 · kind B2 · utility

1Cited by

6References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andre Uhlemann · Dortmund, DE
Alexander Herbrandt · Warstein, DE
Frank Broermann · St. Blasien, DE

Key dates

Filing date	Apr 30, 2012
Grant date	Oct 28, 2014
Priority date	—
Expiry date	Apr 30, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module includes a substrate having an electrically insulative member with opposing first and second metallized sides and one or more semiconductor die attached to the first metallized side of the substrate. A plurality of thermally conductive structures are laterally spaced apart from one another and individually attached directly to the second metallized side of the substrate so that the plurality of thermally conductive structures extend outward from the second metallized side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.