Package structure
US8873244B2 · kind B2 · utility
0Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2010 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Aug 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.