Inventor · Taichung, TW

Pang-Chun Lin

14Patents

3h-index

15Co-inventors

49Inventor score

Filing activity: Apr 13, 2010 → Sep 25, 2015

Most-cited inventions

Patent	Title	Area	Cited by	Status
US7934313B1	Package structure fabrication method	Emerging Cross-Sectional Technologies	125	Active
US9362217B2	Package on package structure and fabrication method thereof	Electricity	3	Active
US8304268B2	Fabrication method of semiconductor package structure	Emerging Cross-Sectional Technologies	3	Active
US9177837B2	Fabrication method of semiconductor package having electrical connecting structures	Electricity	2	Active
US8390118B2	Semiconductor package having electrical connecting structures and fabrication method thereof	Electricity	2	Active
US8421199B2	Semiconductor package structure	Emerging Cross-Sectional Technologies	1	Active
US8525336B2	Semiconductor package and method of fabricating the same	Electricity	1	Active
US9455159B2	Fabrication method of packaging substrate	Electricity	0	Active
US8716861B2	Semiconductor package having electrical connecting structures and fabrication method thereof	Electricity	0	Active
US8873244B2	Package structure	Emerging Cross-Sectional Technologies	0	Active
US9318354B2	Semiconductor package and fabrication method thereof	Electricity	0	Active
US9029203B2	Method of fabricating semiconductor package	Electricity	0	Active
US8981575B2	Semiconductor package structure	Emerging Cross-Sectional Technologies	0	Active
US9171741B2	Packaging substrate and fabrication method thereof	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.