Surface treatment in the formation of interconnect structure
US8877083B2 · kind B2 · utility
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2References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 16, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Ultra-Violet (UV) treatment is performed on an exposed surface of a low-k dielectric layer and an exposed surface of a metal line. After the UV treatment, an organo-metallic soak process is performed on the exposed surface of the low-k dielectric layer and the exposed surface of the metal line. The organo-metallic soak process is performed using a process gas including a metal bonded to an organic group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.