Devices with crack stops
US8877611B2 · kind B2 · utility
1Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.