Flip-chip phosphor coating method and devices fabricated utilizing method
US8878219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2008 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jan 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
Abstract
Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The coating comprising a conversion material at least partially covering the LEDs. The coating is planarized to the desired thickness with the coating being continuous and unobstructed on the top surface of the LEDs. The LEDs chips are then singulated from the submount wafer. An LED chip comprising a lateral geometry LED having first and second contacts, with the LED flip-chip mounted to a submount by a conductive bonding material. A phosphor loaded binder coats and at least partially covers the LED. The binder provides a substantially continuous and unobstructed coating over the LED. The phosphor within the coating absorbs and converts the wavelength of at least some of the LED light with the coating planarized to achieve the desired emission color point of the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.