Patent · US Active

Method and system for providing fusing after packaging of semiconductor devices

US8878335B2 · kind B2 · utility

0Cited by

1References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Josef Boeck · Putzbrunn, DE
Rudolf Lachner · Ingolstadt, DE
Herbert Schaefer · Herdorf, DE

Key dates

Filing date	Dec 23, 2010
Grant date	Nov 4, 2014
Priority date	—
Expiry date	Oct 16, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.