Apparatus and method for analyzing thermal properties of composite structures
US8878926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jul 5, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present invention provide methods and apparatus for analyzing thermal properties of bonding materials within a composite structure. One embodiment of the present invention provides an apparatus for analyzing thermal property of a bonding material within a structure. The apparatus comprises a structure support having a supporting surface configured to support the structure, a heat source configured to direct a heat flux to the structure supported by the supporting surface of the structure support, and a camera facing the structure supported on the structure support and configured to capture thermal images of the structure supported on the structure support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.