Sb-Te base alloy sinter sputtering target
US8882975B2 · kind B2 · utility
4Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Nov 11, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/266
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is an Sb—Te base alloy sinter sputtering target having Sb and Te as its primary component and comprising a structure in which Sb—Te base alloy particles are surrounded by fine carbon or boron particles; wherein, if the mean diameter of the Sb—Te base alloy particles is X and the particle size of carbon or boron is Y, Y/X is within the range of 1/10 to 1/10000. The present invention seeks to improve the Sb—Te base alloy sputtering target structure, inhibit the generation of cracks in the sintered target, and prevent the generation of arcing during the sputtering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.