Methods for removing a metal oxide from a substrate
US8883027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2010 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Sep 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2418
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for generating plasma for removing metal oxide from a substrate is provided. The method includes providing a powered electrode assembly, which includes a powered electrode, a dielectric layer, and a wire mesh disposed between the powered electrode and the dielectric layer. The method also includes providing a grounded electrode assembly disposed opposite the powered electrode assembly to form a cavity wherein the plasma is generated. The wire mesh is shielded from the plasma by the dielectric layer when the plasma is present in the cavity, which has an outlet at one end for providing the plasma to remove the metal oxide. The method further includes introducing at least one inert gas and at least one process gas into the cavity. The method yet also includes applying an rf field to the cavity using the powered electrode to generate the plasma from the inert and the process gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.