Patent · US Active

Substrate for semiconductor package and process for manufacturing

US8884443B2 · kind B2 · utility

5Cited by
65References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 16, 2013
Grant dateNov 11, 2014
Priority date—
Expiry dateMay 16, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/10674
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.