Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
US8893702B2 · kind B2 · utility
5Cited by
37References
20Claims
0Family size
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Key dates
| Filing date | Feb 20, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jul 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T82/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of ductile mode machining a component of a plasma processing apparatus wherein the component is made of nonmetallic hard and brittle material wherein the method comprises single point turning the component with a diamond cutting tool causing a portion of the nonmetallic hard and brittle material to undergo a high pressure phase transformation to form a ductile phase portion of the hard and brittle material during chip formation wherein a turned surface is formed from a phase changed material and the turned surface is a grooved textured surface of phase changed material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.