Patent · US Active

Production of an integrated circuit including electrical contact on SiC

US8895422B2 · kind B2 · utility

0Cited by
10References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 14, 2013
Grant dateNov 25, 2014
Priority date
Expiry dateMar 14, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/64
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Production of an integrated circuit including an electrical contact on SiC is disclosed. One embodiment provides for production of an electrical contact on an SiC substrate, in which a conductive contact is produced on a boundary surface of the SiC substrate by irradiation and absorption of a laser pulse on an SiC substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.