Electronic interconnect system
US8902606B2 · kind B2 · utility
1Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2012 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Feb 13, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/183
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.