Patent · US Active

Device for releasing an interconnect layer that provides connection between a carrier and a wafer

US8905111B2 · kind B2 · utility

0Cited by
16References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 8, 2013
Grant dateDec 9, 2014
Priority date—
Expiry dateAug 8, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1967
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.