Apparatus and method for electroless deposition of materials on semiconductor substrates
US8906446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 29, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Feb 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/288
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.