Patent · US Active

Helix substrate and three-dimensional package with same

US8907464B2 · kind B2 · utility

1Cited by

1References

8Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Huan Wang · Irvine, US
Meiquan Huang · Tianjin, CN
Hejin Liu · Tianjin, CN

Key dates

Filing date	Mar 22, 2013
Grant date	Dec 9, 2014
Priority date	—
Expiry date	Jul 7, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A three dimensional (3D) package includes a helix substrate having a columnar part including a top surface, a bottom surface and a sidewall, and a plurality of steps arranged along the sidewall of the columnar part in the form of a helix. Semiconductor integrated circuits (dies) may be attached on supporting surfaces of the steps. The columnar part, the steps and the dies can be covered with a mold compound. I/Os are formed at either the sides of the steps and/or the top and/or bottom of the columnar part.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.