Patent · US Active

Method for trimming the working layers of a double-side grinding apparatus

US8911281B2 · kind B2 · utility

0Cited by

8References

5Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Georg Pietsch · Burghausen, DE
Michael Kerstan · Burghausen, DE

Key dates

Filing date	Jul 13, 2011
Grant date	Dec 16, 2014
Priority date	—
Expiry date	Apr 6, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/28
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing the grinding apparatus including the upper and lower working disks and providing at least one carrier including an outer toothing. The upper and lower working disks are rotated. The carrier is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. Loose abrasives are added to a working gap formed between the working layers. A carrier, without workpieces inserted therein, is moved in the working gap so as to effect material removal from the working layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.