Post-tungsten CMP cleaning solution and method of using the same
US8911558B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Mar 23, 2011 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Nov 14, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A post-W CMP cleaning solution consists of carboxylic acid and deionized water. The carboxylic acid may be selected from the group consisting of (1) monocarboxylic acids; (2) dicarboxylic acids; (3) tricarboxylic acids; (4) polycarboxylic acids; (5) hydroxycarboxylic acids; (6) salts of the above-described carboxylic acids; and (7) any combination thereof. The post-W CMP cleaning solution can work well without adding any other chemical additives such as surfactants, corrosion inhibitors, pH adjusting agents or chelating agents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.