Deposition ring and electrostatic chuck for physical vapor deposition chamber

US8911601B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Muhammad M. Rasheed · San Jose, US
• Keith A. Miller · Schererville, US
• Rongjun Wang · Dublin, US

Key dates

• Filing date: Oct 25, 2011
• Grant date: Dec 16, 2014
• Expiry date: Oct 25, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.