Method and apparatus for cleaning grinding work chuck using a vacuum
US8915771B2 · kind B2 · utility
3Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Apr 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.