Stress-sensitive micro-electromechanical device and use thereof

US8916944B2 · kind B2 · utility

Assignees

• ELMOS SEMICONDUCTOR SE · DE
• SILICON MICROSTRUCTURES, INC. · US

Inventors

• Bernd Burchard · Dortmund, DE
• Michael Doelle · Munich, DE
• Zhou Ningning · Milpitas, US

Key dates

• Filing date: Mar 15, 2011
• Grant date: Dec 23, 2014
• Expiry date: Mar 15, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0264
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.