Adhesion between post-passivation interconnect structure and polymer
US8916972B2 · kind B2 · utility
12Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a thin oxide film layer directly over a top surface of the PPI structure, and a polymer layer over the thin oxide film layer and PPI structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.